| PART |
Description |
Maker |
| NHD-C0220AU-FSW-FTS |
COG (Chip┸on┸Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| NHD-C12864B2Z-RN-FBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C12864HZ-FN-FBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| THM401020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 1,048,576 WORDSx40位动态RAM模块
1,048,576 WORDSx40 BIT DYNAMIC RAM MODULE
1/048/576 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba, Corp.
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM362020S-10 THM362020S-80 THM362020SG-10 THM3620 |
2097152 WORDS x 36BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 36BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 36BIT DYNAMIC RAM MODULE
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
|
| LEUWS2W-PXQX-4P7R |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| SIGC81T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| 5962R9582501QEC 5962R9582501QXC 5962R9582501VEC 59 |
Radiation Hardened 3-Line to 8-Line Decoder/Demultiplexer 辐射加固3线至8线译码器/解复用器
150 PF 5% 50V NPO/COG (0805) CHIP CAP TR
From old datasheet system
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| BC10-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| BC75-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| S16XXXH S16100NH S1610NH S1616MH S1616NH S16200NH |
The S16xxxH series of SCRs uses a high performance MESA GLASS PNPN technology. 在可控硅S16xxxH系列采用高性能的梅萨玻璃PNPN技术
|
STMicroelectronics N.V.
意法半导
STMICROELECTRONICS[STMicroelectronics]
|
